Aluksen provides a wide range of Optical Modulator Driver chips, including high-performance Mach-Zehnder Modulator Driver, Externally Modulated Laser Driver(EML) and Directly Modulated Laser Driver(DML), which are applicable to Data Center, 5G Wireless carrier Network, Core Optical Network etc optical communication applications ranging from short reach to thousands of kilometres. It supports up to 800Gbps data rate with Surface Mounted Technology(SMT), C4(Controlled Collapse Chip Connection) and bare Die packages.
Part Number | Max Baud Rate(Baud) | Channel(#) | Min input Voltage(mVpp) | Max Output Voltage(V) | Supply Voltage(V) | RF I/O interface | Power Dissipation(W) | Package Type and Size(nmm) |
---|---|---|---|---|---|---|---|---|
AL1341P | 32G | 4 | 300 | 7 | 3.3, 5.5 | Differential / Single-ended | 1.3W@Vout = 6 Vpp | DFN78 (19mm x 13mm x 2.3mm) |
AL1212P | 28G | 1 | 300 | - | 3.3 | Differential / Differential | 0.4W | SMT package (4mm x 4mm x 1.33mm) |
AL1610D | 64G | 1 | 300 | > 3.5 | 3.3, 5.5 | Differential / Differential | 0.4W | DIE (1.2mm x 1.1mm x 0.1mm) |
AL1642D | 56G | 4 | 300 | > 3.5 | 3.3, 5.5 | Differential / Differential | 0.5W per channel | DIE (3.3mm x 1.47mm x 0.1mm) |
AL1648D | 64G | 4 | 300 | > 4.2 | 3.3, 5.5 | Differential / Differential | 0.6W per channel | DIE (3.3mm x 1.47mm x 0.1mm) |
AL1213D | 53G | 1 | 300 | - | 3.3 | Differential / Differential | 0.4W | DIE (1.45mm x 1.1mm x 0.1mm) |